JPS5339872A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Etching method of wafers
Assignee: Hitachi Ltd
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Filing: 1976-09-24
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Granted: —
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Expires: 1996-09-24
Abstract
Abstract PURPOSE: To evenly etch wafer surfaces by so arranging the device that the entire part of etching solution is evenly stirred and the entire part of wafers is contacted to the etching solution. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Hachiro Koyama
- 👤 Oshi Otsuka
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-07 23:29
CPC Classifications
—
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