JPS5334466A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Electrode construction of semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1976-09-10
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Granted: —
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Expires: 1996-09-10
Abstract
Abstract PURPOSE: To increase the surface efficiency of the functional element forming area, by providing the junction support absorbing the effect of the pressing weight at bonding with distortion. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Masanobu Obara
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 10:53
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W72/071; H10W72/075; H10W72/07551; H10W72/50; H10W72/531; H10W72/536; H10W72/59; H10W72/981; H10W72/983
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