JPS5333059A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1976-09-08
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Granted: —
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Expires: 1996-09-08
Abstract
Abstract PURPOSE:To make supporting electrodes by fixing bundles of fire wires of metal having excellent heat and electric conductivity by means of metal of coefficient of thermal expausion mearly equal to or smaller that of a semiconductor substrate.
Inventors
- 👤 Shuichi Osaka
- 👤 Takashi Kondo
- 👤 Masanobu Obara
- 👤 Miyoshi Yoshida
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 19:30
CPC Classifications
H; H10; H10W; H10W72/00
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