JPS5333057A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Bump type semiconductor device
Assignee: NEC Corp
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Filing: 1976-09-09
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Granted: —
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Expires: 1996-09-09
Abstract
Abstract PURPOSE: To prevent the end part contact between lead parts and a substrate, reduce production costs and produce a bump type device by constituting thick bump terminals using Al as a main material. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Masaru Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 16:36
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012
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