JPS5318653A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Resin composition having good heat-sealing properties at low teperature
Assignee: Tosoh Corp
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Filing: 1976-08-04
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Granted: —
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Expires: 1996-08-04
Abstract
Abstract PURPOSE: A resin composition having good adhering and heat-sealing properties at low temperatures and freeness from shrinkage, which is composed of a carboxylated ethylene-vinyl acetate copolymer and a petroleum resin containing alicyclic saturated hydrocarbons. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Shinichi Imura
- 👤 Mitsutaka Saito
- 👤 Nobuo Morishita
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 17:23
CPC Classifications
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