JPS5314560A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Production of semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1976-07-26
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Granted: —
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Expires: 1996-07-26
Abstract
Abstract PURPOSE: To employ simultaneous bonding and evade shorting faults between internal leads and chips by forming dicing grooves then forming a surface protecting film over the entire surface so as to cover the grooves as well. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Masanobu Obara
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 10:54
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W74/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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