JPS5312271A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Substrate for electronic circuit element
Assignee: NEC Corp
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Filing: 1976-07-20
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Granted: —
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Expires: 1996-07-20
Abstract
Abstract PURPOSE: To prevent the flow of brazing materials without using dam materials by forming metallized layers such as of Mo, Mn, etc. having properties of repelling brazing materials between the deposited part and electrically connecting part of electronic circuit elements, exposing a part thereof and providing grooves therein. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Kazuo Noguchi
- 👤 Shinzo Anazawa
- 👤 Yoshiharu Nishimura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-06 17:19
CPC Classifications
—
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