JPS5295973A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Manufacture of semiconductor unit with heat sink
Assignee: Hitachi Ltd
•
Filing: 1976-02-09
•
Granted: —
•
Expires: 1996-02-09
Abstract
Abstract PURPOSE: To improve reliability of junction between the heat sink and the lead frame and to reduce processes of manufacture. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Susumu Okikawa
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 09:05
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.