JPS5269564A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device and its manufacturing process
Assignee: Seiko Epson Corp
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Filing: 1975-12-08
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Granted: —
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Expires: 1995-12-08
Abstract
Abstract PURPOSE: When metallix foil lead wire formed on flexible electric insualting tape extending in longitudinal direction is adhered tightly with metallic contact section formed on semiconductor pellet, metallic foil lead wire is supported at both sides. In this method, deformation is minimized, and junction with metallic contact section can be performed at correct position. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Yoshiharu Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 09:38
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4046
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