JPS5267978A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Boiling-cooling type semiconductor unit
Assignee: Mitsubishi Electric Corp
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Filing: 1975-12-03
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Granted: —
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Expires: 1995-12-03
Abstract
Abstract PURPOSE: To obtain boiling-cooling type semiconductor unit featuring thermal and mechanical high dependability by increasing contact area with cooling agent by making flat the contact surface between element and heat radiator and by providing grooves at the area other than the flat surface. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Yoshio Kimura
- 👤 Hiroshi Mitsuoka
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-31 19:16
CPC Classifications
—
Claims Analysis
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References Cited (Backward Citations)
JPS502868A
Cited
JPS5018457U
Cited
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