JPS5260683A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Measurement of degree of adhesion of electronic parts
Assignee: Mitsubishi Electric Corp
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Filing: 1975-11-13
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Granted: —
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Expires: 1995-11-13
Abstract
Abstract PURPOSE: To eliminate defectives of minute electronic parts by measuring the strength of the bonded part of the electronic parts wire bonded on a thin film thereby simply and quickly evaluating their adhesiveness. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Wataru Shimada
- 👤 Takashi Kondo
- 👤 Jun Kawamoto
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 10:29
CPC Classifications
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