JPS5247686A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device and process for production of same
Assignee: Toshiba Corp
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Filing: 1975-10-15
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Granted: —
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Expires: 1995-10-15
Abstract
Abstract PURPOSE: To prevent warpage by bonding circuit elements to supporting substrates at low temeprature after forming the circuit elements, and increase the scale of integration by forming an emitter region as specified and connecting it to a conductor. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Takashi Matsuda
- 👤 Kazuo Niwa
- 👤 Kosuke Sumitomo
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 07:37
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/01; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/019; H10W10/10
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