JPS5247384A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: NEC Corp
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Filing: 1975-10-13
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Granted: —
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Expires: 1995-10-13
Abstract
Abstract PURPOSE: To make the thick film wiring pattern of the uppermost layer smaller than the width of the wiring metal film pattern of the under layer of a stacking wiring structure, thereby preventing projecting in a cross dirction, peeling and shortcircuiting. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Masaru Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-06 05:19
CPC Classifications
—
Claims Analysis
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References Cited (Backward Citations)
JPS5051257A
Cited
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