JPS5238884A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Method of forming bump of flip chips
Assignee: Mitsubishi Electric Corp
•
Filing: 1975-09-23
•
Granted: —
•
Expires: 1995-09-23
Abstract
Abstract PURPOSE: To make bump height even by thick-film printing of solder paste using a mask. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Masayuki Kataoka
- 👤 Takayoshi Kawakami
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 22:12
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.