JPS522277A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Soldering device
Assignee: Hitachi Ltd
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Filing: 1975-06-24
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Granted: —
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Expires: 1995-06-24
Abstract
Abstract PURPOSE: To prevent the development of voids in a soldering material such as solder. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Kunishige Kishi
- 👤 Akira Kikuta
- 👤 Mitsuo Ito
- 👤 Kenji Akeyama
- 👤 Yoshio Ohashi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 22:46
CPC Classifications
—
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