JPS5216147A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Pacage method for surface elastic wave element
Assignee: Hitachi Ltd
•
Filing: 1975-07-30
•
Granted: —
•
Expires: 1995-07-30
Abstract
Abstract PURPOSE:To improve on reliability of a surface elastic wave element by molding both a substrate surface and the element.
Inventors
- 👤 Masanori Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-30 11:38
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/058; H03H9/059; H03H9/10; H03H9/1064; H03H9/1071; H03H9/1085
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
JPS5428935U
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.