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JPH10154801A Expired / Lapsed JP ⏱️ 0.0 years remaining

Integrated circuit having sidewall capacitor structure and method of manufacturing the same

Assignee: Texas Instruments Inc
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Filing: 1997-10-27
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Granted: —
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Expires: 2017-10-27
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Abstract

Abstract Translated from Japanese (57)【要約】 (修正有) 【課題】 集積回路上に高温かつ高酸素活性条件下で蒸 着される高誘電定数を具備した誘電体を用いた容量性構 造を、使用する電極の信頼性低下を防止しながら形成す る。 【解決手段】 高温かつ高酸素活性条件を必要とする誘 電体膜32を半導体基板10に実質的に垂直な暫定支持 部材54を利用して先に構成し、その後にこの誘電体を 挟むように電極64,64を形成することで上記の問題 を解決する。これらの電極は従来型の構造とは異なり半 導体基板10に対して実質的に垂直な側壁を有する。 PROBLEM TO BE SOLVED: To provide an electrode using a capacitive structure using a dielectric material having a high dielectric constant deposited on an integrated circuit under high-temperature and high-oxygen-active conditions, using an electrode. It is formed while preventing reduction. SOLUTION: A dielectric film 32 requiring a high temperature and a high oxygen activation condition is first formed by using a temporary support member 54 substantially perpendicular to a semiconductor substrate 10, and then the dielectric film is sandwiched therebetween. By forming the electrodes 64, 64, the above problem is solved. These electrodes have sidewalls that are substantially perpendicular to the semiconductor substrate 10, unlike conventional structures.

Inventors

  • 👤 Bruce F Gnade
  • 👤 エフ.グナーデ ブルース
  • 👤 Scott R Summerfelt
  • 👤 アール.サマーフェルト スコット
  • 👤 Peter Kirlin
  • 👤 カーリン ピーター

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 03:07
CPC Classifications
H; H10; H10D; H10D84/00; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/033; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10D1/692; H10D1/694; H10D1/711; H10D1/716

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