Polishing apparatus and polishing method

Abstract

Abstract Translated from Japanese (57)【要約】 【課題】研磨装置に関し、研磨の際の振動を高感度に検 出して研磨のバラツキを精度良く、しかもリアルタイム で検出して研磨時間を短縮し、また、ゴミの存在の確認 を容易にするとともに、定盤の振動の伝達を無線で正常 に行うとともに、研磨状態を捉えるために利用される研 磨固有の振動の検出能力を改善すること。 【解決手段】研磨対象物を支持する第１の定盤３を回転 する駆動機構21と、第１の定盤に対向する第２の定盤２ に張付られた研磨布１と、第１又は第２の定盤に取付け られて研磨時の振動を検出する振動検出器10と、第１の 定盤、第２の定盤の動作を制御する制御部17と、振動検 出器に検出された振動強度を周波数分析し、さらに振動 強度を時間毎に積分し、積分値の時間的変化が基準値を 下回った時、又は積分値が基準値を下回った時の何れか の時点で、前記第１の定盤、前記第２の定盤を停止する 研磨停止信号を前記制御部に送る信号解析手段15とを含 む。 The present invention relates to a polishing apparatus, which detects vibration during polishing with high sensitivity to accurately detect variations in polishing, and also to detect polishing in real time to shorten polishing time, and to detect the presence of dust. In addition to facilitating the confirmation, the vibration of the surface plate is transmitted wirelessly normally, and the ability to detect the vibration peculiar to polishing, which is used to detect the polishing state, is improved. SOLUTION: A drive mechanism 21 for rotating a first surface plate 3 for supporting an object to be polished, and a second surface plate 2 opposed to the first surface plate. Control the operation of the polishing cloth 1 attached to the substrate, the vibration detector 10 attached to the first or second surface plate to detect the vibration during polishing, the first surface plate, and the second surface plate Frequency analysis of the vibration intensity detected by the control unit 17 and the vibration detector, further integrating the vibration intensity every time, when the temporal change of the integrated value is below the reference value, or the integrated value is the reference value. And a signal analysis means 15 for sending a polishing stop signal to the control unit to stop the first surface plate and the second surface plate at any point when

Inventors

• 👤 Jiyunji Fukuroda
• 👤 淳史 袋田
• 👤 Yoshihiro Arimoto
• 👤 由弘 有本
• 👤 Wataru Nakamura
• 👤 亘 中村

Bibliographic Details