Aluminum-titanium alloy target materia for dry-process vapor deposition

Abstract

Abstract PURPOSE: To develop a target to be used when an Al-Ti alloy thin film excellent in resistance to waer and oxidation is formed by dry-process vapor deposition, etc., by mixing an Al powder and a Ti powder in a specified ratio and forming the mixture by hot isostatic pressing. CONSTITUTION: A target having a composition of AlXTi1- X (where 0.3<=X<=0.7) is produced by mixind fine-powder Al and Ti and forming the mixture by hot isostatic pressing. This target is used when the thin film of Al-Ti alloy excellent in resistance to wear and oxidation is formed on the surface of cutting tools, sliding parts, etc., by dry-process vapor deposition such as vacuum deposition and arc ion plating. The impurities in the target consist of <0.3% O2 , <0.05% H2 , <0.2% Cl2 , <0.005% Cu, <0.3% Mg, <0.5% Fe and <0.5% Mn, and the target has 99.0-100% relative density. A communicating hole having >=0.3mm radius is not found in the region from the surface to bottom, and the target has a stabilized discharge characteristic and a long service life.

Inventors

• 👤 Masahiro Machida
• 👤 正弘 町田
• 👤 Yasuyuki Yamada
• 👤 保之 山田
• 👤 Yusuke Tanaka
• 👤 裕介 田中
• 👤 Yasunori Wada
• 👤 恭典 和田
• 👤 Kazuo Yoshikawa
• 👤 一男 吉川
• 👤 Hiroyuki Uchida
• 👤 博幸 内田
• 👤 Yasuyuki Koga
• 👤 保行 古賀
• 👤 Taiji Onishi
• 👤 泰司 大西

Bibliographic Details