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JPH07307490A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method for forming ZnO film for semiconductor photoelectric device

Assignee: Daido Steel Co Ltd
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Filing: 1994-05-10
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Granted: —
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Expires: 2014-05-10
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Abstract

Abstract Translated from Japanese (57)【要約】 半導体光電素子の電極部に透明で導電率の高いZnO膜 を設けた場合に問題となるコンタクト抵抗を低減する。 【構成】 面発光型発光ダイオードのキャップ層上にス パッタリングによってZnO膜を形成した後、800℃ 程度に5分保持してアニールする。 (57) [Summary] A contact resistance, which is a problem when a transparent and highly conductive ZnO film is provided in an electrode portion of a semiconductor photoelectric device, is reduced. [Structure] After forming a ZnO film on the cap layer of the surface emitting light emitting diode by sputtering, the temperature is 800 ° C. Hold for about 5 minutes and anneal.

Inventors

  • 👤 Toshihiro Kato
  • 👤 俊宏 加藤

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 17:33
CPC Classifications
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