Metal member fixing method and metal member fixing device

Abstract

Abstract PURPOSE:To easily execute the stable soldering over the whole joining part of a circuit substrate and shielding cases by inserting a solder between a fixed objective member and a metallic member and heating the metallic member to be positioned to the fixed objective member through the solder. CONSTITUTION:In the circuit substrate 60 mounting various kinds of circuit elements at high density, the shielding cases 71-74 are abutted on a land 61, and a heating part 50 is abutted on a roof plate 71A of the shielding cases 71-74. The cream solder 62 coated between the shielding cases 71-74 and the circuit substrate 60 is heated through the shielding cases 71-74. By this method, the soldering can be executed to the shielding case 71 on the circuit substrate 60 without directly heating the cream solder 62. Then, in the case of abutting the heating part 50 on the roof plate 71A, the shielding cases 71-74 can easily be heated because there is no obstacle around the roof plate 71A.

Inventors

• 👤 Ryoichi Ueno
• 👤 良一 植野
• 👤 Teruyoshi Noda
• 👤 照▲よし▼ 野田

Bibliographic Details