Semiconductor chip sorter

Abstract

Abstract Translated from Japanese (57)【要約】 【目的】半導体チップの品種や半導体ウエーハの製造ロ ットの違いの如何にかかわらず、半導体チップの位置と 良，不良を短時間に容易且つ正確に検査・選別する。 【構成】ウエーハシート２の上面に貼り付けられた状態 で載置台３に搬入された半導体ウエーハ３の上面にスポ ット光を斜めに照射するスポット照明装置５Ａ，５Ｂを 設ける。 (57) [Summary] [Purpose] Regardless of the difference in the type of semiconductor chip or the difference in the manufacturing lot of semiconductor wafers, the position, quality, and defects of semiconductor chips can be easily and accurately inspected and selected in a short time. [Structure] Spot illumination devices 5A and 5B for obliquely irradiating spot light onto the upper surface of a semiconductor wafer 3 loaded onto a mounting table 3 while being attached to the upper surface of a wafer sheet 2 are provided.

Inventors

• 👤 Tatsuro Mihashi
• 👤 龍郎 三橋

Bibliographic Details