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JPH0567480A Expired / Lapsed JP ⏱️ 0.0 years remaining

Anisotropically conductive adhesive resin layer and method for producing the same

Assignee: Toshiba Corp
•
Filing: 1992-01-23
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Granted: —
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Expires: 2012-01-23
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Abstract

Abstract Translated from Japanese (57)【要約】 【目的】 本発明は、異方導電性接着樹脂層において、 導電粒子を均等に分散させることができ、微細ピッチの 接続を可能にする。 【構成】 絶縁性の接着樹脂層11中に導電性の粒子12を 分散させ、該接着樹脂層11の厚み方向のみに導通がとれ る異方導電性接着樹脂層を製造する方法において、導電 性の粒子12を帯電させたのち、帯電させた粒子12をロー ラ22の表面に分散させ、次いで分散させた粒子12を接着 樹脂層11の表面に付着させ、しかるのち付着させた粒子 12を加熱・加圧して接着樹脂層11内に埋め込むようにす る。 (57) [Summary] [Object] The present invention provides an anisotropic conductive adhesive resin layer, comprising: The conductive particles can be evenly dispersed, and fine pitch connection is possible. A method for producing an anisotropic conductive adhesive resin layer in which conductive particles 12 are dispersed in an insulating adhesive resin layer 11 so that conduction can be achieved only in the thickness direction of the adhesive resin layer 11, After charging the particles 12, the charged particles 12 are dispersed on the surface of the roller 22, then the dispersed particles 12 are attached to the surface of the adhesive resin layer 11, and then the particles are attached. 12 is heated and pressed to be embedded in the adhesive resin layer 11.

Inventors

  • 👤 Miki Mori
  • 👤 三樹 森
  • 👤 Masayuki Saito
  • 👤 雅之 斉藤

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-03 18:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W74/00; H10W74/10; H10W74/15

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