Semiconductor device

Abstract

Abstract PURPOSE:To improve resistance to thermal stress after soldering and stabilize the bonding of an external lead with a substrate by providing the external lead in two directions next to each other in the right angle direction of a package body and forming a projecting part at the part of the package body. CONSTITUTION:Since external leads 2 are concentrated and soldered on the two sides next to each other in the right angle direction of a package body 3, the flatness of the package is maintained and the external leads 2 are stably bonded with a substrate 4. When the soldered product is heated or cooled, a semiconductor device 1 and the substrate 4 cause expansion or contraction, however, the two non-soldered sides are released and concentration of thermal stress at a soldering part 5 is modified. Soldering under stable condition is attained by a projecting part 6 provided on the back of the package main body 8 at the position diagonal to the ridgeline where two sides of the package body 8 provided with the external lead 2 cross.

Inventors

• 👤 Taiji Kasatani
• 👤 泰司 笠谷
• 👤 Yasuhiro Murasawa
• 👤 村沢　靖博
• 👤 Toru Tachikawa
• 👤 立川　透

Bibliographic Details