Wafer integrated circuit device

Abstract

Abstract PURPOSE:To facilitate the manufacture of a circuit and improve yield rate by forming a circuit for system and a circuit, which has the function of a wafer integrated circuit, on different wafers. CONSTITUTION:This comprises a wafer 1, where circuits 2 for system and connection pads 3 for the circuits for system are made, and a wafer 2, where circuits 5 which have the functions of constituting a wafer integrated circuit are made at the face opposed to the wafer 1. Through they are not shown in the circuits 5 which have the functions of constituting the wafer integrated circuit, connection pads 6 are provided at the positions conforming to the connection pads 3. The wafer 2, where the circuits 2 are formed, and the wafer 4, where the circuits are formed, are put on the other with the faces, where those circuits 2 and 5 are formed, opposed to each other, and both connection pads are connected by bumps 7 at the opposed faces.

Inventors

• 👤 Koichi Yamashita
• 👤 公一 山下

Bibliographic Details