Substrate for mounting electronic component

Abstract

Abstract PURPOSE:To facilitate the injection of sealing resin by putting the shape of an insulating base material into the shape where chamfered parts are made by cutting angles off four corners. CONSTITUTION:For a board 10 for mounting electronic components, chamfered parts 15 are positively formed at the corners of an insulating base material 12, which is usually formed in a quadrangle, whereby the periphery of the insulating base material 12 opens wide by these chamfered parts 15. Accordingly, when it is supported in the molds of a transfer molding device after mounting electronic components 30 on this board 10 for mounting electronic parts, a passage for fluidified sealing resin 20 is made largely. Hereby, when sealing the board 10 for mounting electronic parts with sealing resin 20, the flow of this sealing resin 20 improves, and also the drop of the resin pressure at the corners of the insulating base material 12 can be prevented, and the occurrence of voids is prevented.

Inventors

• 👤 Tsukasa Yamamoto
• 👤 山元　司
• 👤 Katsumi Kosaka
• 👤 克己 匂坂

Bibliographic Details