Integrated circuit device

Abstract

Abstract PURPOSE:To shorten the longitudinal size of a package by bendably forming a circuit board to be connected to the package and having a long length and a large area, connecting the board to the package and then bending it. CONSTITUTION:A bendable circuit board 8 having substantially longer than the length of a package 1 and the same width and formed with a through hole corresponding to outer leads 2 of the package 1 at its center is prepared. An IC 9 for biasing and a chip components 10 of a resistor, a capacitor are placed at both ends of the board 8. The leads 2 are inserted to the hole 7 and the package l is electrically and mechanically connected to the board 8 by solders 12. Then, both ends of the board 8 are bent substantially at 90 degrees to an opposite side to the package 1. Thus, it can be reduced substantially in the same size as that of the package 1.

Inventors

• 👤 Yoshiro Nishimura
• 👤 芳郎 西村
• 👤 Hitomi Tojiki
• 👤 戸敷　瞳

Bibliographic Details