Structure of wiring pattern

Abstract

Abstract PURPOSE:To prevent a solder flow by a method wherein a wiring pattern is formed into such a structure that with the wiring pattern, which is formed on a substrate, formed in the same width, parts, which are subjected to surface mounting and correspond to a land for surface mounting use, of the leads of a component for surface mounting use to be mounted on the substrate are sectioned from wiring parts by a plurality of slits made in the wiring pattern. CONSTITUTION:A wiring pattern 1 is formed into such a structure that the pattern l which is formed on a substrate is continuously formed in almost the same width and at the same time, parts, which are subjected to surface mounting and correspond to a land 4 for surface mounting use, of leads 3 of a component 2 for surface mounting use to be mounted on the substrate are sectioned from wiring components 1a by a plurality of slits 10 made in the pattern 1. Thereby, a solder flow at the time of the surface mounting due to soldring can be dissolved by the existence of the slits 10 and at the same time, it becomes possible to prevent the deviation of mounting of the component 2.

Inventors

• 👤 Kenji Kimura
• 👤 建次 木村
• 👤 Fumio Toki
• 👤 土岐　文雄

Bibliographic Details