Mounting structure for semiconductor device

Abstract

Abstract PURPOSE:To enhance a heat-dissipating effect and a high speed by a method wherein, when a semiconductor device is mounted, a signal line is extracted by using a metal lead and a power line and a GND line are extracted by using electrode blocks. CONSTITUTION:A multilayer interconnection layer 2 is formed on the main surface of an IC chip 1; and electrode blocks 5a and 5b are bonded to electrode pads 3a and 3b by using a solder 4. Then, a signal line is extracted to a connecting pad 15 via a metal lead 14. The electrode blocks 5a and 5b are used as extraction electrodes for GND use and for power use; and they are endowed with heat-dissipating routes. In addition, the metal lead 14 is endowed with a low-inductance property. Thereby, a high-speed performance can be realized without using a special cooling system.

Inventors

• 👤 Teruo Kusaka
• 👤 日下　輝雄

Bibliographic Details