Semiconductor device

Abstract

Abstract PURPOSE:To place two semiconductor elements in one package without increasing the profile of the package and to reduce thermal resistance by providing at least one film on each of the active surfaces of the elements, and holding a lead from above and below. by the active surfaces of the two elements. CONSTITUTION:Two semiconductor elements 1a, 1b are oppositely placed in one package. A film 2 is connected to the active surfaces of the elements 1a, 1b through an adhesive layer 5a. The film 2 has a through hole 6 in which its inside is metal-plated, and the hole 6 is aligned with an electrode 7. The film 2 is connected to a lead 3 through an adhesive layer 5b, and the electrode 7 is electrically connected with conductive adhesive. These members are sealed with sealing resin 4. The material of the film is, for example, desirably polyimide, and epoxy resin is, for example, used as the adhesive. The frame 3 is held by two sets of the members constituted in this manner, and the electrode 7 is electrically connected to the frame 3 via the hole 6 with a conductive adhesive such as solder.

Inventors

• 👤 Nae Yoneda
• 👤 米田　奈柄
• 👤 Makoto Kitano
• 👤 誠 北野
• 👤 Asao Nishimura
• 👤 西村　朝雄
• 👤 Akihiro Yaguchi
• 👤 昭弘 矢口
• 👤 Ryuji Kono
• 👤 竜治 河野

Bibliographic Details