Resin-sealed semiconductor device

Abstract

Abstract PURPOSE:To enhance integration by preparing two composed elements, opposing the surface provided with wiring patterns, holding a lead frame, then electrically connecting the pattern to the frame by solder, etc., and eventually resin-sealing part of the frame and a semiconductor element. CONSTITUTION:Two semiconductor elements 1a, 1b are oppositely placed in one package. Insulation films 3 are connected to circuit forming surfaces of the elements 1a, 1b via adhesive layers 8b, and wiring patterns 4 are connected to the films 3 via adhesive layers 8a. Electrodes 7 provided at the centers of the elements 1a, 1b are electrically connected to the patterns 4 via wires 5. The pattern 4 is electrically connected to a lead frame 2 through a conductive adhesive layer 9 at the end of the package. These members are sealed by sealing resin 6.

Inventors

• 👤 Makoto Kitano
• 👤 誠 北野
• 👤 Asao Nishimura
• 👤 西村　朝雄
• 👤 Akihiro Yaguchi
• 👤 昭弘 矢口
• 👤 Ryuji Kono
• 👤 竜治 河野
• 👤 Nae Yoneda
• 👤 米田　奈柄

Bibliographic Details