Adhesive composition for flexible printed circuit board

Abstract

Abstract PURPOSE:To obtain an adhesive composition excellent in flexibility and heat resistance by using as the constituents a thermosetting resin and an acrylonitrile- butadiene rubber having the internal double bonds hydrogenated. CONSTITUTION:A thermosetting resin (e.g. phenolic resin or epoxy resin) and an acrylonitrile-butadiene rubber having at least 80% internal double bonds hydrogenated are used as the essential constituents to give the title composition. Because of the incorporation of the rubber, this composition has improved heat resistance and suffers a reduced loss in adhesive power even after heating. Also, it has excellent flexibility since the acrylonitrile-butadiene rubber, not an acrylic rubber having poor flexibility, is used as the rubber component.

Inventors

• 👤 Hideki Maezawa
• 👤 前澤　英樹

Bibliographic Details