JPH04259291A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Electronic device
Assignee: Hitachi Ltd
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Filing: 1991-02-14
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Granted: —
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Expires: 2011-02-14
Abstract
Abstract PURPOSE:To offer structure having a good cooling effect by uniformly cooling a semiconductor device to be loaded on an electronic device. CONSTITUTION:In a substrate 1 to be loaded on a memory device 2 of a computer, the substrates 1 mounting IC on both sides are by turns slantedly laminated and air is sent into from the side having a larger flow path sectional area by fans 3, or fins are arranged on the back of the single-facedly mounted substrate 1 so as to heighten the height from upwind to downwind.
Inventors
- 👤 Nae Yoneda
- 👤 米田 奈柄
- 👤 Makoto Kitano
- 👤 誠 北野
- 👤 Asao Nishimura
- 👤 西村 朝雄
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 18:10
CPC Classifications
—
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