JPH04237154A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor package
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1991-01-22
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Granted: —
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Expires: 2011-01-22
Abstract
Abstract PURPOSE:To enable a semiconductor package which can be enhanced in mounting density to be offered by a method wherein the semiconductor package is lessened in occupying area. CONSTITUTION:A semiconductor package is mounted on a board 4 where an electrode 4a is provided, and a first external terminal 3a installed so as to come into area contact with the surface of the board 4 and a second external terminal 3b installed in parallel with the first external terminal 3a and distant from it by an interval h equivalent to the thickness of the board 4 are provided.
Inventors
- 👤 Kazuo Murata
- 👤 和夫 村田
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-24 08:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10; H10W; H10W74/00
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