Method for manufacturing multilayer wiring circuit board

Abstract

Abstract PURPOSE:To obtain high-accuracy circuit patterns by a method wherein an insulative photosensitive resin is applied on a conductive temporary base material, the circuit patterns are formed by an exposure and a developing, a metal plated layer is formed on opened conductive parts, an insulating paint is applied on the metal plated layer leaving one part of each circuit pattern, the exposed circuit patterns are made to connect to one another by a conductive paint and the temporary base material bonded to a substrate with a bonding agent id peeled an removed. CONSTITUTION:A photosensitive film 2 is laminated on a stainless steel foil, witch is used as temporary base material 1, a photomask having a pattern is closely adhered in a vacuum and after ultraviolet rays are irradiated on the film 2 to sensitize, the film 2 is developed to remove non-sensitized parts of the film 2. Then, a gold plating is applied and moreover, a nickel plating is applied, a metal plated layer 3 is formed and the unnecessary photosensitive film is removed. Then, necessary places of the layer 3 are left and an insulating paint 4 is applied by screen printing and is heated and hardened. Then, a screen printing is performed using a conductive paint 5 and circuit patterns plated with a metal are made to connect to one another by heating and hardening the paint 5. Then, an epoxy bonding agent 6 is performed a screen printing on the paint 5, then, a glass epoxy substrate 7 is applied and after the substrate 7 is heated and hardened, the material 1 is peeled and removed.

Inventors

• 👤 Takuya Yagasaki
• 👤 矢ケ崎　琢也
• 👤 Koji Tanabe
• 👤 功二 田邉

Bibliographic Details