Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To enable small-quantity multi-kind products to be manufactured more easily with manufacture conditions kept constant regardless of contents of mount circuits by arranging cells having metallized patterns connected to neither in-chip elements nor other wirings and by substantially uniforming the total wiring length of each wiring layer regardless of mount circuits. CONSTITUTION:Basic cells 11-15 are arranged in a plural array form, and wiring channels 16 are provided between these basic cell arrays. A basic cell 14 contains only a dummy wiring connected to neither in-chip elements nor wirings. In the case of a large scale of a mount circuit with a long total length of wiring, dummy wiring cells 14 are arranged in a small number; reversely in the case of a small scale of a mount circuit with a short length of wiring, they are arranged in a large number, whereby the total wiring length of each wiring layer is substantially uniformed. This design makes manufacture conditions constant regardless of the scale of mount circuits and enables easy manufacture of small-quantity multi-kind products.

Inventors

• 👤 Yasumi Kurashima
• 👤 倉島　保美

Bibliographic Details