Solid state image sensor

Abstract

Abstract PURPOSE:To reduce in size a solid state image sensor by conducting a chip side pad electrode to a package side pad electrode to be conducted with a lead provided at the package for electrically connecting to an exterior through a bump material by a pattern lead. CONSTITUTION:A solid state image sensor 90 is composed of a solid state image sensor chip 91, a package 92 for mounting the chip 91, a chip side pad electrode 93 provided at the light receiving surface side of the chip 91, a package side pad electrode 94 provided at the light receiving surface side of the package 92, leads 95 provided at the package 92 for conducting to the electrode 94 and electrically connected to an exterior, and a pattern lead 97 provided on a transparent member 94 for sealing the light receiving surface side of the chip 91 for conducting the electrode 93 with the electrode 94 through a bump material 96. The electrode 93 is conducted to the electrode 94 for conducting to the leads 95 provided at the package 92 for electrically connecting to the exterior through bump materials 96, 96 by the lead 97.

Inventors

• 👤 Kiyoshi Tsuji
• 👤 辻　潔

Bibliographic Details