Package for semiconductor device

Abstract

Abstract PURPOSE:To easily check the state of solder on a circuit board and intend a high density packaging by providing both surfaces of a substrate with connection terminals connected electrically beforehand to the wirings of a semiconductor chip to make electrical connection to the wirings of the circuit board. CONSTITUTION:A semiconductor chip (C) is placed on a recessed part 1a located about the center of a ceramic multilayer substrate 1. Lead wires 2, 2,... wire- bonded to a bonding pad provided on the semiconductor chip (C) are provided on the periphery of the recessed part 1a. Each of the lead wires 2, 2,... is connected by an inner wiring to one of exposed terminals provided on the edge parts of the top surface and bottom surface of the substrate 1 respectively. First lead wires 3, 3,... are connected to the corresponding terminals on the top surface of the substrate 1, and second lead wires 4, 4,... are connected to the corresponding terminals on the bottom surface of the substrate 1. Both the first and second lead wires 3, 4 are bent in the shape of gull wing.

Inventors

• 👤 Masamichi Shindo
• 👤 進藤　政道

Bibliographic Details