Semiconductor integrated circuit module

Abstract

Abstract PURPOSE:To absorb a stress exerted on an outer lead by a difference in a coefficient of thermal expansion of a constituent material by a method wherein a coating material which keeps rubber-like state is coated thick in a compression direction of a bent part of the outer lead before module molding operation. CONSTITUTION:A semiconductor integrated circuit chip 10 is bonded to a die pad 11 formed on a lead frame; electrodes on the semiconductor integrated circuit chip 10 are connected to inner leads 1a by using metal thin wires; after that, this assembly is resin-sealed with a sealing resin 2 for package use; outer leads 1b are processed to be a prescribed shape. After that, the outer leads 1b of a semiconductor integrated circuit package are mounted on electrodes formed on a board 3 for module use by using an adhesive material 4 such as a solder or the like. Then, the outer leads 1b are coated, to be thick, with a coating material 6 which keeps a rubber state within a guaranteed temperature range for a module molding operation in a compression direction of bent parts of the outer leads 1b.

Inventors

• 👤 Seiji Takemura
• 👤 竹村　誠次

Bibliographic Details