Processing method for surface of rigid substrate

Abstract

Abstract PURPOSE:To uniformize the roughness of the rigid substrate surface over the inner peropheral part from the outer peripheral part in a short time by one polishing, by rotating the polishing roll of a deformed roll and rigid substrate and making the relative speed of the both about constant over the inner peripheral part from the outer peripheral part of this substrate. CONSTITUTION:A deformed roll whose outer diameter R1 of the part abutting on the inner peripheral part 6a of a rigid substrate to be subjected to surface treatment is made larger than the outer diameter R2 of the part abutting on the substrate outer peripheral part 7a is used as a polishing roll 8. When this polishing roll 8 and rigid substrate 7 are rotated at the specific rotation speed, the relative speed of the both 7, 8 becomes about constant over the inner periph eral part 6a from the outer peripheral part 7a of the rigid substrate 7. Conse quently, the surface roughness in the peripheral direction of the rigid substrate 7 surface becomes almost uniform over the inner peripheral part 6a from the outer peripheral part 7a of this substrate 7 by polishing once.

Inventors

• 👤 Zenkichi Nakamura
• 👤 中村　善吉

Bibliographic Details