Ceramic multilayer interconnection board

Abstract

Abstract PURPOSE:To obtain high inductance of a coil in a compact structure by forming a magnetic field of a coil of a layer for forming a coil pattern of high permeability ceramics. CONSTITUTION:A ceramic multilayer circuit board 1 is formed by laminating five ceramic insulating layers 2, 3, 4, 5, 6. A connecting conductor 7 is formed on the surface of the layer 2 of the uppermost part, coil patterns 8 are formed on the surfaces of the layers 3, 4, 5 of the intermediate parts, hole conductors 9 are provided on the layers 2, 3, 4, and the conductor 7 is connected to the pattern 8 of the layer 5. The layers 3, 4, 5 are formed of ferrite ceramics having high permeability, and the layers 2, 6 of the upper and lower parts are formed of alumina ceramics having low permeability. The three patterns 8 are superposed to form a coil. Since the coil has large permeability in its magnetic field part, its magnetic flux is increased to increase its inductance.

Inventors

• 👤 Katsu Yamada
• 👤 克 山田
• 👤 Kenichi Hoshi
• 👤 健一 星

Bibliographic Details