Ceramic circuit board containing capacitor

Abstract

Abstract PURPOSE:To form a bypass capacitor at an arbitrary position of a multilayer ceramic board and to enhance the degree of freedom of a circuit design by forming a capacitor layer between a power source pattern layer and a ground pattern layer in the board. CONSTITUTION:Conductors 1 for electrodes, conductors 4 for wirings and conductors 8 for viaholes are formed of Ag-Pd printing paste. Viaholes 8 are formed suitably in response to a design at an insulator sheet except for forming a capacitor, and a wiring printing and a viahole printing are conducted by a screen printing method. An insulator sheet 4 for forming a capacitor is formed with viaholes suitably in response to a design, the viaholes are printed by a screen printing, lands are provided from the viaholes, and electrodes for the capacitor are screen printed at a part except the lands on a whole sheet piece face. The viaholes are formed at a conductor sheet 6 suitably in response to a design, and printed by a screen printing method. These sheets are laminated, thermally press-adhered, baked to form a multilayer board.

Inventors

• 👤 Hideto Kamiaka
• 👤 上赤　日出人
• 👤 Osamu Sugano
• 👤 修 菅野
• 👤 Masaaki Toyama
• 👤 正明 外山
• 👤 Senjo Yamagishi
• 👤 山岸　千丈

Bibliographic Details