Circuit board and image sensor using the same

Abstract

Abstract PURPOSE:To obtain a mounting circuit board having a relatively low sheet resistance value and high density wiring patterns which include narrow line width between lines by forming the patterns in a plurality of grooves formed on the surface of the board. CONSTITUTION:Conductive ink in which suitable vehicle, additive for providing adequate fluidity, viscosity characteristic, etc., are added to noble metal powder of Au, Ag, etc., is fed into a plurality of rows of grooves 12A formed by cutting the surface of a glass board 11, and cured to form a wiring pattern 12. The depths of the grooves 12A are sufficiently increased to increase the thickness of the pattern 12 thereby to reduce a sheet resistance even if the width of the grooves 12A is very narrowed, thereby simply forming a plurality of rows of wiring patterns having very high density and low resistance.

Inventors

• 👤 Tsukasa Shiraishi
• 👤 司 白石

Bibliographic Details