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JPH0332837A Expired / Lapsed JP ⏱️ 0.0 years remaining

Multilayer packing material

Assignee: Dow Mitsui Polychemicals Co Ltd
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Filing: 1989-06-29
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Granted: —
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Expires: 2009-06-29
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Abstract

Abstract PURPOSE:To enhance heat sealability, fragrance retentivity and pinhole resistance by constituting a heat sealing layer of a polymer composition consisting of copolymerized polyester with a specific m.p. whose constituents consist of terephthalic acid, isophthalic acid and ethylene glycol and an ethylene/(meth) acrylic acid copolymer or a metal salt thereof. CONSTITUTION:A packing material consists of a surface base material layer and a heat sealing layer and the heat sealing layer is composed of a polymer composition consisting of 60-90 pts.wt. of copolymerized polyester with an m.p. of 205-240 deg.C whose constituents consist of terephthalic acid, isophthalic acid and ethylene glycol and 10-40 pts.wt. of an ethylene/(meth)acrylic acid copolymer or a metal salt thereof. (Meth)acrylic acid means acrylic acid or methacrylic acid. As the base material layer, a metal, paper and various thermoplastic resins are used.

Inventors

  • 👤 Hiroshi Ito
  • 👤 伊東 浩史
  • 👤 Yoshio Mishima
  • 👤 三島 義男

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 07:53
CPC Classifications
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