Semiconductor device

Abstract

Abstract PURPOSE:To make it compact and to improve the characteristics of a semiconductor device by connecting another semiconductor device between frames inside a IC package. CONSTITUTION:A die pad 4 is made the potential of a power source, and a capacitor chip 3 is connected between the die pad 4 and the earth. By this constitution, it also becomes the measures against latch-up, noise, etc., and the resistance decreases by the amounts of wiring than the case where the capacitor is mounted extremely, so electric properties improve and the wiring for external connection becomes needless, and more compact design becomes possible.

Inventors

• 👤 Yoshio Akiyama
• 👤 秋山　義雄
• 👤 Akinori Kai
• 👤 開　章範
• 👤 Yuji Kihara
• 👤 雄治 木原

Bibliographic Details