Structure of optical semiconductor module

Abstract

Abstract PURPOSE:To eliminate the bending of an optical fiber and to reduce the thickness size of the module by inserting the fiber through the side wall of a package in parallel with a substrate and optically coupling the optical fiber and a semiconductor chip via an optical direction changing member at the front end of the insertion. CONSTITUTION:A ferrule 57 holding the optical fiber 58 of the optical semiconductor module 1 penetrates the side wall in the package 2 fixed with the optical semiconductor module chip 52 in the inside bottom and is inserted in approximately parallel with the substrate. The optical direction changing member 8 having a mirror 7 at the front end part of the insertion is provided and the light of the optical fiber 58 is opticalally coupled to the optical semiconductor module chip 52. The optical fiber 58 is disposed in parallel with the substrate in this way and, therefore, the fiber is protected without bending. Since the height size over the entire part of the semiconductor module is reduced, the efficiency of packaging the substrate to a shelf, etc., is improved.

Inventors

• 👤 Kenji Tagawa
• 👤 憲治 田川
• 👤 Takayuki Masuko
• 👤 益子　隆行
• 👤 Akira Okamoto
• 👤 明 岡本

Bibliographic Details