Dicing of semiconductor wafer

Abstract

Abstract PURPOSE:To make it possible to separate a semiconductor wafer comprising chips of different sizes into the chips using only one roller by a method wherein the upper part of the wafer with scribing lines engraved therein is pressed by the roller, whose curvature of the outer peripheral surface in the direction perpendicular to the axis of the roller is partially different. CONSTITUTION:The section of a roller 11 comprises a part A of a large curvature radius and a part B of a small curvature radius. In a semiconductor wafer 1, there are two kinds of chip sizes, for example, and scribing lines 1A are engraved in the wafer 1. When the roller 11 is rotated around a rotating axis 10 on the semiconductor substrate 1 and a pressure is applied to the substrate 1, each part of the wafer is pressed in the curvatures, which apply to the chip sizes, of the roller and the wafer can be separated into chips along the lines 1A in the direction perpendicular to an orientation flat 1B by only one operation.

Inventors

• 👤 Tokuya Ooishi
• 👤 大石　篤哉

Bibliographic Details