Semiconductor device

Abstract

Abstract PURPOSE:To avoid the alignment slip between the mutual packages in the soldering steps while augmenting the connection strength between the mutual packages by a method wherein the lower end of an input.output terminal of an upper step package is inserted into the upper end side of the input.output terminal of a lower step package. CONSTITUTION:The lower end of an input.output terminal 3b of a middle step package Q is inserted into a hole l as an engaging part of the input.output terminal 3c of a lower step package R so as to be soldered. Furthermore, the lower end of an input.output terminal 3a of an upper step package P is inserted into another hole l as the engaging part of the input output terminal 3b so as to be soldered and then the metallic vessels 1 are brazed with each other. Through these procedures, a semiconductor device having high connection strength with upper-lower step packages P-R accurately aligned by the mutual insertion of the input.output terminals can be manufactured.

Inventors

• 👤 Tsutomu Hiroki
• 👤 広木　勉
• 👤 Toshihiro Fusayasu
• 👤 房安　俊広
• 👤 Kazuo Kawahara
• 👤 河原　一雄
• 👤 Koji Yamada
• 👤 浩嗣 山田

Bibliographic Details