Connecting method for semiconductor integrated circuit element

Abstract

Abstract PURPOSE:To elastically deform metal bumps and to stably connect them by forming elastically deformable metal bumps on at least one of electrode pads and an electrode terminal, opposing the pads to the terminal, and press-bonding a semiconductor circuit element to a liquid crystal display device substrate. CONSTITUTION:Elastically deformable metal bumps 3 are integrally formed on electrode pads 2. An IC chip 1 containing the pads 2 and soft metal bumps 3 is coated with ultraviolet ray curable resin 5. An LCD substrate 4 manufactured by glass, etc., containing electrode terminals 2a is cleaned, and coated with the resin 5. The bumps 3 on the pads 2 are opposed to the terminals 2a, and the chip 1 is placed on the substrate 4. The chip 1 is pressed to elastically deform the bumps 3, and the bumps 3 are brought into close contact with the terminals 2 by its repulsion force.

Inventors

• 👤 Yoshihiko Nio
• 👤 仁尾　吉彦

Bibliographic Details