Molding die for lead of ic

Abstract

Abstract PURPOSE:To prevent peeling of a plating layer due to friction by holding and fixing the root of a lead by a pad and a shedder and also by providing a first lead molding die having a roller which runs on the lateral sides of the pad and the shedder so as to bend the fore end part of the lead, and a second lead molding die having a punch which presses the root of the bent lead against a die element so as to bend the same in one direction. CONSTITUTION:A roller 10 running on the lateral sides of a pad 4a and a shedder 5a is provided. The fore end part of an external lead 8 held by the pad 4a of a top die 1 and the shedder 5a of a bottom die 2 between is bent onto the top die 1 side by making said roller 10 run. A second IC lead molding die is provided with a punch 3a outside a pad 4b and a shedder 5b. The root and its neighboring part of the external lead of IC of which the fore end part is bent by a first IC lead molding die is lowered in the direction of an arrow 11a so that the fore end part of the punch 3a may come into vertical contact with the face of a die element 6a, and thereby the root and its neighboring part of the external lead 8 is formed.

Inventors

• 👤 Kobo Minami
• 👤 南　弘法

Bibliographic Details